专利名称：Heat dissipating structure for electronic
terminal device
发明人：Masahiro Yamaguchi申请号：US09/262052申请日：19990304公开号：US06101095A公开日：20000808
摘要：A heat dissipating structure for an information terminal device such as anelectronic cash register includes a substrate mount chassis having a heat dissipatingportion. The substrate mount chassis has disposed in a chamber thereof a substrate. Thesubstrate is arranged in the chamber of the substrate mount chassis and has disposedthereon an electronic component such as a high-speed CPU which generates a relativelylarge amount of heat. A heat conducting member such as a silicone rubber is disposedbetween the CPU and the heat dissipating portion in contact therewith for dissipating theheat generated by the CPU into the surrounding atmosphere.
申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
代理人：Louis Woo
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