专利名称：Resin composition and uses of the same发明人：Hsien-Te Chen,Mei-Ling Chu,Tsung-Hsien
Lin,Chih-Wei Liao
申请号：US13161311申请日：20110615公开号：US08734950B2公开日：20140527
摘要：A resin composition is provided. The resin composition comprises an epoxy resinand a hardener, wherein the amount of the hardener is about 10 parts by weight to about200 parts by weight per 100 parts by weight of the epoxy resin and the hardenercomprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a secondSMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleicanhydride m1, the second SMA copolymer has a molar ratio of styrene to maleicanhydride m2, and m1−m2≧3.
申请人：Hsien-Te Chen,Mei-Ling Chu,Tsung-Hsien Lin,Chih-Wei Liao
地址：Chupei TW,Chupei TW,Chupei TW,Chupei TW
国籍：TW,TW,TW,TW
代理机构：Greer, Burns & Crain, Ltd.
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