专利名称：Method for electrochemically depositing
metal on a reactive metal film
发明人：Roey Shaviv,Ismail T. Emesh,Dimitrios
Argyris,Serdar Aksu
申请号：US14637316申请日：20150303公开号：US09828687B2公开日：20171128
专利附图：
摘要：In accordance with one embodiment of the present disclosure, a method fordepositing metal on a reactive metal film on a workpiece includes electrochemically
depositing a metallization layer on a seed layer formed on a workpiece using a platingelectrolyte having at least one plating metal ion, a pH range of about 1 to about 6, andapplying a cathodic potential in the range of about −0.5 V to about −4 V. The workpieceincludes a barrier layer disposed between the seed layer and a dielectric surface of theworkpiece, the barrier layer including a first metal having a standard electrode potentialmore negative than 0 V and the seed layer including a second metal having a standardelectrode potential more positive than 0 V.
申请人：APPLIED Materials, Inc.
地址：Santa Clara CA US
国籍：US
代理机构：Christensen O'Connor Johnson Kindness PLLC
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