专利名称：ELECTRONIC POWER MODULE发明人：VLADIMIROVA, Kremena,CREBIER, Jean-Christophe,WIDIEZ, Julie
申请号：EP19774162.2申请日：20190902公开号：EP3847694A2公开日：20210714
摘要：The invention relates to an electronic power module (100) comprising at least: -a semiconductor chip (102) comprising at least one electronic power component; - twometal layers (108, 110), between which the semiconductor chip is directly secured, andsuch that at least a first (108) of the two metal layers forms a redistribution layercomprising several distinct metal portions (109), each electrically connected to at leastone electrical contact pad of the semiconductor chip, and/or such that at least onesecond (110) of the two metal layers comprises at least one first structured face
arranged against the semiconductor chip and comprising at least one pad (112) formed ina part of its thickness.
申请人：Commissariat à l'énergie atomique et aux énergies alternatives,CentreNational de la Recherche Scientifique
地址：Bâtiment \"Le Ponant D\" 25 rue Leblanc 75015 Paris FR,3, rue Michel-Ange 75794Paris Cedex 16 FR
国籍：FR,FR
代理机构：Brevalex
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