专利名称：SHOCK ABSORBING EXPANDED ADHESVIE
AND ARTICLES THEREFROM
发明人：BOGNER, Josh M.,MILLIMAN, Henry W.申请号：EP15714074.0申请日：20150313公开号：EP3116965A2公开日：20170118
摘要：Adhesive formulations comprising expandable microspheres are described.After forming into a layer or region and expanding, the expanded adhesive layer exhibitsexcellent impact absorbing characteristics. The expanded adhesive layer also exhibitsexcellent vibration damping properties.
申请人：Avery Dennison Corporation
地址：207 Goode Avenue Glendale, CA 91203 US
国籍：US
代理机构：Müller-Boré & Partner Patentanwälte PartG mbB
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容